
ACS711
Thermal Characteristics
Hall Effect Linear Current Sensor with Overcurrent
Fault Output for < 100 V Isolation Applications
Characteristic
Package Thermal Resistance,
Junction to Lead
Package Thermal Resistance,
Junction to Ambient 2
Symbol
R θ JL
R θ JA
Test Conditions 1
LC package, mounted on Allegro ASEK 711 evalua-
tion board
LC package, mounted on Allegro 85-0404 evaluation
board, includes the power consumed by the board
EX package, mounted on Allegro 85-0528 evaluation
board, includes the power consumed by the board
Value
5
23
24
Units
oC/W
oC/W
oC/W
1 Additional
thermal information available on the Allegro website
2 The Allegro
evaluation board has 1500 mm 2 of 2 oz. copper on each side, connected to pins 1 and 2, and to pins 3 and 4, with thermal vias
connecting the layers. Performance values include the power consumed by the PCB. Further details on the board are available from the
Frequently Asked Questions document on our website.
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
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